REGISTERED
on 16 Jan 2024
Last Applicant/ Owned by
Tokyo 105-8634
JP
Serial Number
79355754 filed on 25th Aug 2022
Registration Number
7273111 registered on 16th Jan 2024
Correspondent Address
Theodore R. Remaklus Wood, Herron & Evans, L.L.P.
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
TECHXIV
Silicon; pure non-metallic silicon sold in plates; pure non-metallic silicon sold in bars; polycrystal silicon; crystalline silicon in the form of single crystal silicon ingots; crystalline silicon in the form of single crystal silicon ingots for integrated circuits; nonferrous metals, namely, silicon TECH FOURTEEN Non ferrous metal and their alloys; ingots of common metal Semi-conductors; semi Read More
Classification Information
Class [009]
Computer & Software Products & Electrical & Scientific Products
Semi-conductors; semi-conductor wafers; semi-conductor silicon wafers; crystal silicon wafers; optical glasses
First Use Date in General
11th 000101
First Use Date in Commerce
11th 000101
Class [006]
Metal Products
Non ferrous metal and their alloys; ingots of common metal
First Use Date in General
11th 000101
First Use Date in Commerce
11th 000101
Class [001]
Chemical Products
Silicon; pure non-metallic silicon sold in plates; pure non-metallic silicon sold in bars; polycrystal silicon; crystalline silicon in the form of single crystal silicon ingots; crystalline silicon in the form of single crystal silicon ingots for integrated circuits; nonferrous metals, namely, silicon
First Use Date in General
11th 000101
First Use Date in Commerce
11th 000101
Class [040]
Treatment & Processing of Materials Services
Material treatment, namely, crystallizing of silicon; slicing of semi-conductor silicon ingots; slicing of single crystal silicon ingots; slicing of metal ingots; cutting of semi-conductor wafers; cutting of semi-conductor; metal cutting; grinding of semi-conductor wafers; grinding of semi-conductor; grinding of metals; polishing of semi-conductor wafers; polishing of semi-conductor; polishing of metals; grinding; burnishing by abrasion; etching of semi conductor wafers; etching of semi-conductor; etching of metals; beveling of semi-conductor wafers; cleaning of semi-conductor wafers; cleaning of semi-conductor; surface treatment of semi conductor wafers by epitaxial growth; surface treatment of semi-conductor wafers by vapor deposition for forming thin films; material treatment, namely, impurity diffusion on semi-conductor wafers for forming diffusion layers; metalworking; metal treating; ceramic processing; glass processing; cutting of glass; grinding of glass
First Use Date in General
11th 000101
First Use Date in Commerce
11th 000101
Mark Details
Serial Number
No 79355754
Mark Type
No Service Mark
Attorney Docket Number
No SHG-687-122
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
Yes
66A Current
Yes
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 07th May 2024 | FINAL DECISION TRANSACTION PROCESSED BY IB |
| 17th Apr 2024 | FINAL DISPOSITION PROCESSED |
| 17th Apr 2024 | FINAL DISPOSITION NOTICE SENT TO IB |
| 16th Apr 2024 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
| 22nd Jan 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| 16th Jan 2024 | REGISTERED-PRINCIPAL REGISTER |
| 16th Jan 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| 06th Nov 2023 | NOTIFICATION PROCESSED BY IB |
| 31st Oct 2023 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| 31st Oct 2023 | PUBLISHED FOR OPPOSITION |