LASC

Class [040]
Treatment & Processing of Materials Services

Crystal wafer etching treatment; Integrated circuit etching treatment; Semiconductor sealing processing; Wafer Foundry; Custom manufacture of semiconductors for others; Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions; Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions; Services of manufacturing and assembling semiconductors and integrated circuits according to customer specifications; Manufacturing silicon wafers and integrated circuits according to customer instructions; Assembly services of silicon wafers and integrated circuits; Polishing services for silicon wafers and semiconductors; Assembling integrated circuits, photomasks and electronic or computer chips for others; Foundry services of semiconductors and integrated circuits; Semiconductor and integrated circuit packaging processing; Foundry semiconductor chip cutting and packaging processing services; Wafer etching and dicing processing; Etching processing; Cutting or forming of integrated circuits; Manufacturing and processing of integrated circuits