on 09 Jun 2020
Last Applicant/ Owned by
Ranzan-machi, Hiki-gun, Saitama 355-0222
JP
Serial Number
79262857 filed on 08th Apr 2019
Registration Number
6071820 registered on 09th Jun 2020
Correspondent Address
Kumiko Ide
Filing Basis
No Filing Basis
Disclaimer
NO DATA
Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials f Read More
Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; photoresists; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; chemical coatings for use in the process of producing printed circuit boards
Paints for blocking light; paints for reflecting light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing ink
Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics
No 79262857
No Service/Collective Mark
No TM200002USIP
No
No
No
No
No
No
No
No
Status Date | Action Taken |
---|---|
18th Oct 2020 | FINAL DECISION TRANSACTION PROCESSED BY IB |
29th Sep 2020 | FINAL DISPOSITION NOTICE SENT TO IB |
29th Sep 2020 | FINAL DISPOSITION PROCESSED |
09th Sep 2020 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
09th Jun 2020 | REGISTERED-PRINCIPAL REGISTER |
24th Mar 2020 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
24th Mar 2020 | PUBLISHED FOR OPPOSITION |
04th Mar 2020 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
18th Feb 2020 | APPROVED FOR PUB - PRINCIPAL REGISTER |
29th Jan 2020 | TEAS/EMAIL CORRESPONDENCE ENTERED |